Friday, June 6th 2025
Coracer's GPE-01 Graphene Pad for AM5 Achieves 130 W/m·K Conductivity
Coracer, a lesser-known Chinese accessories manufacturer, recently introduced a version of its GPE-01 graphene thermal pad specifically designed for AMD's AM5 processors. Until now, this pad has been compatible only with Intel's LGA 1851 and LGA 1700 sockets. The new AM5 model measures 32×32 mm, allowing it to cover the entire IHS without hanging over the edges. Thermal paste has long been the go-to option for filling the microscopic gap between CPU and cooler, but in recent years, enthusiasts have explored alternatives like liquid metal and pre-cut thermal pads. Graphene-based products have gained traction because graphene conducts heat exceptionally well. Coracer claims its GPE-01 combines graphene with silicon to achieve a thermal conductivity of 130 W/mK, which is about twice that of popular liquid metal compounds. An insulating layer around the graphene prevents any risk of shorting out the processor's circuits.
Coracer also asserts that the GPE-01 can maintain performance for up to ten years. Regular thermal paste tends to dry out and degrade over time, requiring reapplication every few years. A graphene pad like this could eliminate that chore until you swap out your CPU unless you keep the same system for over a decade. Interestingly, Coracer has almost no online footprint. Segotep, another Chinese brand, introduced a GPE-01 pad for Intel CPUs late last year, so it's unclear whether Coracer is a spin-off or if Segotep licensed the design. As of now, there's no word on pricing or availability for the AM5 version. The Intel-focused GPE-01 sells for around $15 on Taobao, which is in line with other premium pads. Without independent reviews, it's hard to know if Coracer's conductivity claim holds up in real-world testing, but graphene's reputation does offer some reason for cautious optimism. We tested a similar product, Thermal Grizzly's KryoSheet, with a conductivity of 7.5 W/m·K, so hopes are high for the GPE-01.
Source:
Tom's Hardware
Coracer also asserts that the GPE-01 can maintain performance for up to ten years. Regular thermal paste tends to dry out and degrade over time, requiring reapplication every few years. A graphene pad like this could eliminate that chore until you swap out your CPU unless you keep the same system for over a decade. Interestingly, Coracer has almost no online footprint. Segotep, another Chinese brand, introduced a GPE-01 pad for Intel CPUs late last year, so it's unclear whether Coracer is a spin-off or if Segotep licensed the design. As of now, there's no word on pricing or availability for the AM5 version. The Intel-focused GPE-01 sells for around $15 on Taobao, which is in line with other premium pads. Without independent reviews, it's hard to know if Coracer's conductivity claim holds up in real-world testing, but graphene's reputation does offer some reason for cautious optimism. We tested a similar product, Thermal Grizzly's KryoSheet, with a conductivity of 7.5 W/m·K, so hopes are high for the GPE-01.
13 Comments on Coracer's GPE-01 Graphene Pad for AM5 Achieves 130 W/m·K Conductivity
Links to Noctua and Thermal Grizzly answers on thermal conductivity:
Why doesn’t Noctua specify thermal conductivity or thermal resistance of NT-H1 and NT-H2?
Thermal Grizzly FAQ (see third last question)
Anyway, would be interesting to see this tested, though I still am rather “meh” on graphene pads. Makes sense for reviewers who often swap CPUs and coolers, but for anyone looking to set easily and forget a PTM pad would probably serve better.
The listed thermal conductivity might not even be a complete lie though still a useless number in practice.
All of that is to say, it doesn't matter what TIM you use for AMD CPUs, as long as they're using the chiplet design (Threadripper and Epyc being exceptions), you'll have roughly the same performance with respect to heat transfer. The thermal conductivity values (knowing those are already inflated and also not really useful to the end user) mean nothing. Even if the TIM had a true thermal conductivity of 130W/mK, it would never transfer anywhere near that rate because the bottleneck occurs before heat even reaches the TIM. The bottleneck is the die size. It's even more evident if you delid and direct-die cool with liquid metal. You'll see the exact same range of temps whether you delidded with liquid metal or used the factory IHS with the most basic thermal paste.