Last March, CD Projekt RED (CDPR) announced the end of developing major content updates for Cyberpunk 2077. Instead, a smaller group would concentrate on pushing out smaller batches post-launch content. At the time, international studio priorities were shifting to next-gen productions—namely The Witcher 4 (Poland), and a Cyberpunk sequel (North America). The last multi-platform patch—version 2.21, consisting mostly of fixes and improvements—arrived on January 23. Almost half a year later, industry watchers have noticed intriguing Virtuos employee activity on LinkedIn—indicating some sort of "unannounced Cyberpunk 2077 DLC" collaboration with CDPR. Lately, this contract developer is best known for its modernization/remastering of Bethesda's classic The Elder Scrolls IV: Oblivion (2006) open world RPG.

During a mid-week "REDstreams—Cyberpunk 2077 on Nintendo Switch 2" live broadcast, Alicja Kozera—a company senior community manager—fielded queries from the community. One individual brought up the subject of rumored future DLC—Kozera responded: "I can tell you right now, we are planning another part for the game. The last one wasn't the (final) one." Yesterday evening, Marcin Momot—CDPR's Global Community Director—outlined a loose schedule, regarding an upcoming preview: "we're not done yet! Stay tuned for more info about the next Cyberpunk 2077 update coming later this month. We'll start spilling the beans closer to the release of patch 2.3 (that's its name), so for now, we ask for a bit more patience. Let the team cook!" Naturally, Virtuos has not been named as a collaborator. CDPR is no stranger to outsourcing; as revealed in a recent CyberPunk 2077 Switch 2 build discussion. Additionally, Saber Interactive was roped in as the primary porter of The Witcher 3 onto the original Switch hybrid console.

Post-Computex 2025, another hint about NVIDIA's next rung of current-gen mobile graphics cards has emerged online. Mid-week, harukaze5719 shared an intriguing screenshot of PCI IDs, accompanied by a brief message: "2d80-2dff = GB207." Most of the captured information is common knowledge, but an unreleased model was present. The "GeForce RTX 5050 Max-Q/Mobile" entry will likely translate into real life laptop/notebook form by mid-summer.

harukaze5719's leaked list seems to confirm the future deployment of a "GB207M" GPU die—likely the smallest and least potent iteration of Team Green's "Blackwell" gaming line. According to fresh reportage, a desktop sibling is supposedly being lined up for launch in July. A late April theory suggested AMD's preparing of RDNA 4 mobile "Radeon RX 9000M" GPUs; the least powerful options—reportedly based on a Navi 44 die—could compete with NVIDIA's GeForce RTX 5060 Laptop design. Rival timelines are unclear, but manufacturing partners (Lenovo, LG, MSI, Razer etc.) seem to be prepping a plethora of Team Green-based portable gaming devices.

Mid-way through last month, Tencent's President—Martin Lau—confirmed that this company had stockpiled a huge quantity of NVIDIA H20 AI GPUs, prior to new trade restrictions coming into effect. According to earlier reports, China's largest tech firms have collectively spent $16 billion on hardware acquisitions in Q1'25. Team Green engineers are likely engaged in the creation of "nerfed" enterprise-grade chip designs—potentially ready for deployment later on in 2025. Huawei leadership is likely keen to take advantage of this situation, although it will be difficult to compete with the sheer volume of accumulated H20 units. The Shenzhen, Guangdong-based giant's Ascend AI accelerator family is considered to be a valid alternative to equivalent "sanction-conformant" NVIDIA products.

The controversial 910C model and a successor seem to be worthy candidates; as demonstrated by preliminary performance data, but fresh industry murmurs suggest teething problems. The Information has picked up inside track chatter from unnamed moles at ByteDance and Alibaba. During test runs, staffers noted the overheating of Huawei Ascend 910C trial samples. Additionally, they highlighted limitations within the Huawei Compute Architecture for Neural Networks (CANN) software platform. NVIDIA's extremely mature CUDA ecosystem holds a significant advantage here. Several of China's prime AI players—including DeepSeek—are reportedly pursuing in-house AI chip development projects; therefore positioning themselves as competing with Huawei, in a future scenario.

Prior to early May, the existence of AMD's Radeon RX 9060 XT 8 GB GDDR6 model seemed to be in question. Discerning graphics card buyers tend to opt for larger pools of VRAM. In the modern era, 12 GB or 16 GB options are preferred in budget-to-mid-range segments. Additionally, media outlets are growing weary with a continued delivery of new-gen 8 GB offerings. Yesterday, Digital Foundry's Richard Leadbetter expressed a similar sentiment: "unhappily, AMD did not sample the 8 GB version of the (Radeon RX 9060 XT) card—perhaps because it knows the kind of reception it would receive from a tech press that are mostly united about the need for 8 GB cards to be shown the door." The site's Technology Editor was not alone in voicing frustrations about certain conditions that apply to international members of the media.

Yesterday, Linus Tech Tips (LTT) pulled back a major curtain. Their leaking of an alleged "official review guideline" demonstrates some level of exerting too much control. LTT shared a screenshot of AMD's "commitment to the press" (see below). On the subject of evaluators gaining access to the cheaper (baseline MSRP: $299) Navi 44 XT GPU-based card, a liaison stated: "as for the 8 GB models, AMD has enabled global reviews of both 16 GB and 8 GB models of the Radeon RX 9060 XT based on regional market demand. So in short, yes, there are some other global publications that are receiving 8 GB models for testing." VideoCardz's tracking of day one critiques reveals an almost complete seeding of 16 GB variants (starting at $349). Vitally, TechPowerUp's W1zzard will be reaching into his own pocket(s). As outlined in his reviews of various better equipped options: "since it wasn't possible to get an 8 GB model for review, everyone focused on 16 GB models. I'll buy one of course as soon as possible, to get you the crucial info how it performs." Back in April, (on his own dime) TPU's resident GPU critic acquired a Gainward GeForce RTX 5060 Ti 8 GB retail specimen. At the time, NVIDIA caught plenty of flak—only GeForce RTX 5060 Ti 16 GB models were distributed to reviewers and influencers.

At the tail end of Q1'25, industry whispers suggested that TSMC's premier facilities had completed cutting/leading-edge 2 nm (N2) trial production runs. By early April, company insiders alluded to a confident push into preparations for a futuristic 1.4 nm node at the "P2" Baoshan Plant. This is a very distant prospect; watchdogs envision a 2028 release window. According to expert predictions, cross-facility 2 nm wafer mass production phases are expected to start by the end of this year. Foundry staff seem to be actively pursuing an improvement in yields; earlier guesstimates indicated the crossing of a 70% milestone—good enough for full-blown manufacturing runs.

Fresher musings point to staffers and advanced equipment achieving and stepping just beyond an impressive 90% mark, albeit with silicon intended for "memory products." As of mid-May, Samsung's competing "SF2" product—allegedly—remains in testing phases. South Korean insider news reports posit 2 nm GAA trial yields passing 40%—a significant development for the megacorp's foundry business. Roughly a month ago, (in public) TSMC leadership spoke about an unprecedented demand for 2 nm wafers. Due to rumors of greater than anticipated charges for important TSMC clients, Samsung Semi's top brass is supposedly trying to woo the likes of NVIDIA and Qualcomm.

Yesterday, keen trackers of brand-new Xbox accessories stumbled upon the first-ever 4 TB Storage Expansion Card—courtesy of Seagate. Prior to a fresh discovery of the (now inactive) listing on Best Buy, Xbox Series X|S owners were only able to select 512 GB, 1 TB, and 2 TB options (produced by Seagate and WD). Since launching back in 2020, Microsoft's proprietary SDD design remains a controversial prospect—mostly due to high prices, associated with the utilization of a CFExpress standard. In comparison, Sony's rival current-gen consoles—the PlayStation 5 and PlayStation 5 Pro—can be user upgraded with relatively reasonably-priced standard-sized internal M.2 SSDs (depending on specs). The Xbox Series Expansion Card requires less "tech expertise," since it is simply inserted into a special rear port.

Before the scrubbing of Best Buy's prematurely published product page, gaming news outlets focused on a $429.99 cost of ownership. It is unclear whether eager customers have secured first batches of stock, but Microsoft and Seagate (its official storage provider partner) have not issued any press material regarding the leaked 4 TB flagship model. Curiously, Best Buy's brief sale included a special launch discount. According to screen captures, the normal MSRP would be $499.99. Seagate's 2 TB SKU is currently on offer: $219.99 (instead of $259.99), while the WD BLACK C50 2 TB card sports a full price tag of $299.99. Naturally, better value is offered by (USB-connected) external solutions. As of early 2025, hardcore storage enthusiasts can link up 16+ TB storage devices to Microsoft's Xbox Series X and S machines. Industry experts believe that Seagate's 4 TB Storage Expansion Card will be introduced during this weekend's (Sunday, June 8) Xbox Games Showcase.

AMD's upcoming Radeon RX 9060 XT has shown up in the news a number of times leading up to the expected retail launch, from AsRock's announcement to a recent Geekbench leak that put the RDNA 4 GPU ahead of the RX 7600 XT by a fair shout. Now, however, we have a gaming benchmark from 3DMark Time Spy showing the RX 9060 XT nearly matching the RX 7700 XT, and those results could still improve as drivers mature and become more stable. The benchmark results are courtesy of u/uesato_hinata, who got their hands on an XFX Swift AMD Radeon RX 9060 XT 16 GB and posted their results on r/AMD on Reddit.

There are a few caveats to these performance figures, though, since the redditor who shared the results was using beta drivers and a moderate GPU overclock and undervolt—cited as "+200mhz clock offset -40mv undervolt +10% power limit, I can get 3.46Ghz at 199 W". With those performance tweaks, however, the RX 9060 XT puts up a respectable result of 14,210 points in 3DMark Time Spy. For comparison, the average RX 7700 XT scores 15,452 points in the same benchmark. However, it should also be noted that the gaming PC used in the RX 9060 XT benchmark in question was powered by a rather old AMD Ryzen 5 5600 paired with mismatched DDR4-2133 RAM, meaning there is likely at least some performance left on the table, even if GPU utilization seems consistently high in the 3DMark monitoring chart, indicating there was little bottlenecking limiting the performance. The redditor went on to benchmark the GPU in Black Myth: Wukong, where it managed a 64 FPS average at stock clocks at 1080p, with most settings set to high. Applying the overclock boosted average FPS to a mere 65 FPS, but increased the minimum FPS from 17 to 23. These numbers also won't be representative of the performance for all RX 9060 XT GPUs, since we know that AMD is launching both 8 and 16 GB versions of the RX 9060 XT with different GPU clock speeds for the different memory variants

During a recent Computex keynote presentation, Qualcomm announced the next edition of its Snapdragon Summit. This year's event will take place in Hawaii, starting on September 23 and concluding on the 25th. The company's 2024 new product showcase took place last October, so an earlier than expected scheduled follow-up has caused industry observers to raise a collective eyebrow. Insiders foresee an unveiling of Qualcomm's next-gen flagship notebook/slimline laptop processor; mid-April leaks produced a smattering of elevated (generational) performance numbers. Late last week, Roland Quandt weighed in with fresh pre-release theories: "SC8480XP aka SD X2 Elite in testing with 64 GB RAM... looking like (an) 18-core thing, more and more."

Not long ago, the tenured semiconductor industry watcher linked the alleged Snapdragon X2 Elite flagship chip to a SK Hynix 48 GB RAM and 1 TB SSD-equipped SiP (System-in-Package) test platform. Mid-March "import-export database records" pointed to early evaluations of 18-core processor designs. The very best current-gen Snapdragon X Elite SoC leverages a 12-core "Oryon" design. Additional murmurs have driven speculation about diversified Snapdragon X2 Elite chips; allegedly powering desktop applications. Q1'25 rumors suggested the existence of setups configured with 120 mm AIO cooling solutions.

We have not heard much about Intel's much-debated "Arrow Lake-S Refresh" (or ARL-S Refresh) desktop CPU family in the second quarter of this year. Going back to March, Golden Pig Upgrade predicted another revival of Team Blue's troubled mid-gen update—aka the Core Ultra 300 series. A week or two later, Jaykihn—another tenured discloser of inside track info—theorized an upcoming lineup of "-K and -KF only" SKUs. Hardcore PC hardware enthusiasts and overclockers will likely welcome these unlocked offerings, but an alleged lack of "normal" refreshed options will sting certain consumer bases. The ever intrepid momomo_us has discovered an interesting tidbit; bringing and end to two+ months of "Arrow Lake-S Refresh" silence.

A leaked "W880 PCH" workstation-grade motherboard flow diagram mentions support for "Arrow Lake-S Refresh." This is under the banner of "Core Ultra (Series 2) processors up to 125 W TDP." Unsurprisingly, we are looking at repeat business with the current generation's LGA 1851 socket platform. Intel is still working on the "Nova Lake‑S" (NVL‑S) CPU range; serving as a natural successor to their "Arrow Lake-S" desktop lineup. Lately, data miners have unearthed details regarding a matching "LGA 1954" socket type. According to official announcements, "Nova Lake" processors are "on track" to launch somewhere within 2026. Before then, "Arrow Lake-S Refresh" CPUs are expected to arrive later this year—possibly signalling the final tranche of "ARL."

Three weeks ago, Kurnal and Geekerwan dived deep into Nintendo's alleged Switch 2 chipset. The very brave Chinese leakers are notorious for their acquiring of pre-release and early silicon samples. Last week, their collective attention turned to a brand-new Xiaomi mobile chip: the XRING 01. After months of insider murmurs and official teasers, the smartphone giant recently unveiled its proprietary flagship SoC. According to industry moles, Xiaomi has invested a lot of manpower into a special chip design entity—leadership likely wants to avoid a repeat of prior first-party developed disappointments. Despite rumors of disappointing prototype performance figures, mid-May Geekbench results pointed to the emergent XRING 01 mobile chip being up there with Qualcomm's dominant Snapdragon 8 Elite platform. Die shot analysis has confirmed Xiaomi's selection of a TSMC 3 nm "N3E" node process; also utilized by the latest Apple, Qualcomm and MediaTek flagships. Overall die size is 114.48 mm² (10.8 x 10.6 mm), with 109.5 mm² of used area; comparable to Apple's A18 Pro SoC footprint (refer to Geekerwan's comparison shot, below).

Unlike nearby rivals, the XRING 01 seems to not sport an integrated 5G modem. Notebookcheck surmised: "it is rumored to use an external radio from MediaTek. It isn't located on the actual die itself, and likely a contributing factor to why its size is so small." Annotations indicate the presence of off-the-shelf/licensed Arm CPU cores (ten in total): two Cortex-X925 units, four Cortex-A725 units, two Cortex-A725 units, and two Cortex-A520 units. Additionally, an Arm Immortalis-G925 MP16 iGPU was identified. A 6-core NPU—with 16 MB of cache—was highlighted, but it is not clear whether this is a proprietary effort or something bought in. Observers have noted the absence of SLC cache. GSMArena posited: "the Geekerwan team speculates that (Xiaomi's) omission of the SLC has hurt GPU efficiency—it's pretty fast, but it uses more power than the Dimensity GPU at peak performance. The more efficient CPU combined with the fact that the GPU rarely runs at full tilt makes for pretty good overall efficiency in real-life gaming tests." The XRING department's debut product is impressive, but industry watchdogs are looking forward to refined variants or full-fledged successors.

It seems as though an official international launch for the elusive AMD Ryzen 9000G APUs might still be on the cards for later this year, after all. While an announcement was expected at Computex 2025, along with a full-scale retail launch later this year, AMD was suspiciously quiet about its CPUs at the electronics trade show. Now, it looks as though Gigabyte has seemingly started preparing its B650 motherboard line-up for the arrival of AMD's Ryzen 9000G APUs.

On Gigabyte's B650 Gaming motherboard memory compatibility page, the hardware maker seems to have replaced any mention of Ryzen 9000 series CPUs with "Ryzen 9000 G-series CPUs," altogether. It's unclear whether this change means the same memory compatibility table will apply for both AMD Ryzen 9000 and 9000G CPUs, but that seems to be the case. At any rate, this leak suggests that previous rumors claiming a Q4 launch may have been correct. Those same leaks suggested that the Ryzen 9000G APUs would feature AMD Zen 5 CPU cores paired with AMD RDNA 3.5 iGPUs, with the top-spec iGPU likely being capable of running at least some lighter-weight games and e-sports titles. As it stands, the iGPUs found in recent AMD Ryzen CPUs are merely there for basic video output and diagnostic purposes, while the G-series APUs are generally intended for use without a dedicated GPU. It seems reasonable to expect AMD to launch at least one variant in the AMD Ryzen 9000G APU series equipped with the Radeon 890M, which also powers some of the most popular Windows gaming handhelds on the market.

The Nintendo Switch 2 hybrid console is due to launch globally next Wednesday (June 4). The highly anticipated next-gen handheld is powered by a custom NVIDIA processor. To the surprise of many industry watchdogs, both parties have semi-recently disclosed a couple of technical details regarding their fruitful hardware collaboration. Historically, Nintendo has guarded many aspects of its past generation hardware. Throughout the 2020s, data miners and leakers have unearthed plenty of pre-release information—leading to theories about the Switch 2 chipset's origins. During the Switch 1 era, TSMC was the chosen manufacturing partner. NVIDIA's off-the-shelf Tegra X1 mobile SoC powered the first wave of Nintendo Switch (2017) devices, in 20 nm form. A 2019 revision resulted in Switch Lite and (refreshed) Switch models being equipped with a more efficient 16 nm solution, also present within 2023's premium OLED variant.

Since then, Switch 2's alleged NVIDIA Tegra T239 SoC was linked to a Samsung 8 nm node process. Earlier this month, extremely brave Chinese leakers produced "full die shot" evidence of South Korean foundry origins. Bloomberg insider news articles have implied that Samsung Semi's mature 8 nm FinFET node is better suited—rather than an equivalent TSMC product—for the Switch 2's custom NVIDIA chipset. Unnamed sources have mentioned critical factors; namely stable production and process compatibility. Industry moles reckon that Samsung leadership is actively and aggressively pushing for a longer Switch 2 chipset production deal. Renewed terms could include a future die shrink; pre-launch analysis indicates a sizeable 207 mm² footprint. Beyond foundry biz negotiations, additional murmurs suggest company executives dangling an OLED panel supply agreement. Industry experts have viewed Samsung's key entry—into the gaming console chip market—as a seismic development. A DigiTimes article dives into a so-called "tripartite cooperation"—involving Nintendo, NVIDIA, and the South Korean semiconductor giant. The Samsung Foundry has floundered and struggled in recent times, but is keen to catch up with its arch rival. Fresh rumors have AMD and Sony considering Samsung's chip making channels; possibly with futuristic PlayStation hardware in mind.

Last month, NBD shipping documents linked Intel's next-gen "Nova Lake‑S" (aka "NVL‑S") desktop processor family to an LGA 1954 socket type. Given Team Blue's track record, consumers are not overly enthused by the prospect of another change in mounting profiles. Famously, the current-gen Core Ultra "Arrow Lake-S" CPU series required a fresh slate of motherboards design—centered around LGA1851. Fortunately, a late March-authored shipping manifest has indicated that a successor will leverage nigh identical dimensions. This intriguing leak was shared on social media by Ruby_Rapids—they happily surmised: "the package size of FCLGA1954 is 45×37.5 mm, too. Today's coolers are mechanically compatible with Nova Lake-S."

Despite leveraging a greater number of pins, the supposed LGA 1954 footprint could grant support for cooling solutions that were designed during the eras of LGA1851 and LGA1700. Naturally, a shift into next-gen Team Blue desktop processor territories will necessitate a fresh swath of mainboards. In sharp contrast, AMD enthusiasts remain happy about the AM5 socket's long-term prospects. According to official company timelines, Core Ultra "Nova Lake‑S" processors are "on track" for a loose 2026 launch window. 2 nm manufacturing details were leaked last month; indicating TSMC's involvement.

Throughout the Spring season, Electronics Arts (EA) has reduced development team numbers across several of its international first-party game development studios. According to a fairly fresh IGN news report, another North American operation has been shutdown. Cliffhanger Games was working on a triple-A Black Panther intellectual property, with Marvel's full approval—as teased back in mid-2023. IGN's inside sources have leaked an email—allegedly authored by Laura Miele, EA Entertainment's president—that was addressed the latest round of layoffs at Cliffhanger Games, and unspecified "mobile and central teams." Apparently these adjustments are necessary; Miele (reportedly) believes that these changes will: "sharpen our focus and put our creative energy behind the most significant growth opportunities...These decisions are hard. They affect people we've worked with, learned from, and shared real moments with. We're doing everything we can to support them—including finding opportunities within EA, where we've had success helping people land in new roles." In recent times, company leadership had openly discussed a move away from licensed IP projects. Supposedly, Miele's email mentions a focus on core EA franchises going forward: The Sims, Skate, Battlefield, and Apex Legends.

eXtas1s, a somewhat unreliable source of inside track info has weighed in with related news. The Spanish leaker shared an offbeat claim: "I have learned that around 400 more layoffs are coming at EA, the total closure of Codemasters HQ, and that those developers will be integrated into EA Sports (F1), and a new Need For Speed that is already in development." Going back to late April, EA declared that an unspecified number of layoffs were underway at Codemasters. Earlier this month, the long-running British racing game specialist had stopped working on the popular WRC franchise. Since then, NACON—a French publication house—has picked up the FIA World Rally Championship license. Within the same time period, an official announcement outlined the cancelation of two unannounced projects at Respawn Entertainment. Prior to cessations, the Los Angeles, California-based outfit was working on two "early stage" titles—insider reports suggested that one of these mystery IPs was some sort of nascent Titanfall title. Interestingly, Respawn's leader—Vince Zampella—is steering the next Battlefield game. Several EA studios have been roped into a multipronged production approach.

Just over a week ago, the Radeon RX 9060 XT graphics card became official; introduced as the fastest gaming GPU option for "under $350." It represents the second wave of AMD's RDNA 4 GPU generation, but definitive verdicts are not expected until a lifting of review embargoes—likely happening the day before retail release: June 4. Evaluation samples are very likely in the possession of media outlets and influencers; as evidenced by pre-launch benchmark results appearing within the Geekbench Browser database. A nondescript Radeon RX 9060 XT 16 GB model was put through OpenCL and Vulkan wringers, via "Geekbench 6.2.2 for Windows AVX2." Overall tallies are 109315 and 124251, respectively. The test rig consisted of Team Red's Ryzen 7 9800X3D CPU, a Gigabyte X870E AORUS MASTER motherboard, and 32 GB of DDR5-8000 RAM.

Geekbench results are not the best indicators of gaming performance on modern PC platforms, but semi-useful data can be compared to figures generated by predecessors and current-gen siblings. Quick analysis points to the benchmarked Radeon RX 9060 XT 16 GB sample pulling ahead of its RDNA 3-based elder—the Radeon RX 7600 XT—by 25 to 31%. Stepping up against the Radeon RX 7700 XT 12 GB model, the plucky new candidate trails by 14% in OpenCL stakes and 12% in Vulkan. Naturally, a performance gulf exists between the Radeon RX 9070 16 GB (non-XT) card and its forthcoming smaller sibling—almost a +23% difference in OpenCL, and roughly +32% in Vulkan. Crucially, other Geekbench Browser entries suggest that NVIDIA's competing GeForce RTX 5060 Ti 16/8 GB and RTX 5060 8 GB designs hold slight advantages in terms of OpenCL numbers. AMD's Navi 44 XT GPU-powered card nudges just beyond the RTX 5060's overall Vulkan result. A clearer picture of Radeon RX 9060 XT's standing will be painted next week; stay tuned for TechPowerUp's inevitable in-depth analyses of board partner specimens.

Back in January, keen trackers of internal Team Blue developments stumbled upon encouraging signs of new Arc Xe2 "Battlemage" graphics card activity. Fast-forward to Computex 2025; where Intel and involved board partners unveiled Pro-grade B60 and B50 workstation card products. In the interim, rumors of a canceled "BMG-G31" GPU-based gaming series turned up online. Leading up to last week's important trade event, Team Blue's social media accounts were actively engaging with the community—mostly answering queries regarding a speculated Arc Xe2 "B770" model. According to secretive show floor banter, higher-end B-series gaming graphics cards could be lined up for a fourth quarter launch (this year).

Freshly discovered "BMG" identifiers were highlighted by Lasse Kärkkäinen—this latest tip-off was directed at GawroskiT, Haze2K1 and x86deadandback. At various points in 2024 and 2025, these veteran industry observers have unearthed crucial "Battlemage" inside track information. Team Blue's Mesa graphics driver for Linux was updated late last week; Kärkkäinen's attention was drawn by 0xe220, 0xe221, 0xe222 to 0xe223 device codes. These IDs seemingly exist in a separate category, distinct from "BMG-21." Intel's B580 and B570 cards are based on "Battlemage" BMG-21 GPU die foundations. According to Wccftech's expert opinion: "at least two of these listings belong to Intel's recently-unveiled Battlemage 'ARC Pro' variants...The rest of the two device IDs will belong to newer models, and the one we anticipate to be unveiled is the Arc B770, since Intel 'indirectly' confirmed its release at Computex, but this will occur in the latter part of the year, presumably at Intel Innovation 2025." Inevitably, the Arc Xe2 "Battlemage" family will be succeeded by "Celestial"—recent leaks have suggested development of Xe3 reaching a pre-silicon validation phase.

NVIDIA's oft-leaked GeForce RTX 5050 Mobile 8 GB GPU did not make a debut appearance at last week's Computex trade show. Given the very recent launch of GeForce RTX 5060 8 GB laptops, truly cost-conscious buyers will need to wait patiently for the next wave of even cheaper portable "Blackwell" hardware. Mid-way through the month, a British e-tailer inadvertently published pre-launch prices. Lenovo's least expensive option—utilizing a GeForce RTX 5050 Mobile card—sported a (likely placeholder) tag of £1149.97 (inc. VAT). So far, a lot of pre-release information has been sourced from official websites or webstores.

Yesterday, VideoCardz shared another NDA-buster—courtesy of Acer's "Predator and Nitro Gaming Laptop GPU Power Specifications page." At the time of writing, offending items are no longer present within this list. Prior to removal, three configurable Nitro AI laptop models (16, 16S, and 18) were visible with GeForce RTX 5050 specifications (alongside RTX 5060, 5070 and 5070 Ti options). Only clock speed and TGP data points were logged by the notorious investigator (see below). Currently, TechPowerUp's GPU database entry contains speculative information—a "GB207" GPU identifier was unearthed a while ago, but some insiders reckon that Team Green's GeForce RTX 5050 Mobile design will be based on "GB206" silicon. Additionally, debates continue to rage over the selection of GDDR7 or GDDR6 VRAM. So far, all launched tiers of NVIDIA's GeForce RTX 50-series have emerged with GDDR7 memory modules.

Prior to AMD's official unveiling of the Radeon RX 9060 XT series, Sapphire's Computex booth teased a forthcoming lineup of custom graphics card options. Hours later, the TechPowerUp crew inspected freshly wall-mounted specimens. To the surprise of many, the Hong Kong-based manufacturer is readying a premium Radeon RX 9060 XT 16 GB NITRO+ SKU for launch time (on June 5). The usual suspects—in PULSE and PURE guises—were also exhibited within the walls of the Taipei Nangang Exhibition Centre. Not long after the closing of ceremonies, Sapphire China's JD.com store has opened up pre-orders for six launch day products.

Yesterday, a VideoCardz investigative piece delved into pre-release price points (including VAT). Keen potential customers can secure finalized retail units via a deposit system; demanding a 50 RMB (~$7 USD) upfront fee. Unsurprisingly, the largest tag is affixed to Sapphire's triple-fan 16 GB NITRO+ model—3299 RMB (~$458 USD). This top-tier option sits 800 RMB above Team Red's suggested guideline. The AIB's barebones dual-fan Radeon RX 9060 XT PULSE 8 GB package adheres to official MSRP: 2499 RMB (~$347 USD). Their PULSE 16 GB model sits almost in the middle of the lineup—in terms of pricing—at 2899 RMB (~$402 USD). VideoCardz believes that another PULSE color/finish variant will emerge, at some point post-launch—bringing the total number of items up to seven distinct products.

The rising profile of ChangXin Memory Technologies (CXMT) has supposedly attracted international scrutiny as-of-late. Despite dealing in commercial memory product lines—currently DDR5, DDR4, LPDDR5 and LPDDR4X—the Chinese manufacturer could be stepping up its game in the near future. According to a fresh DigiTimes Asia news report, the nation's "top DRAM supplier" could be freeing up production capacity—in favor of enterprise-grade third-gen High-Bandwidth Memory (HBM3). Industry moles believe that a major sacrifice will be made; namely CXMT's DDR4 line. Despite an alleged early 2025 ramping up of related activities, the firm's factories could refocus on new endeavors by mid-2026. Additionally, insiders reckon that company leadership is shifting commercial priorities: "by year-end 2025, DDR5 is expected to make up more than 60% of CXMT's output, alongside LPDDR4/5."

The move into more advanced memory technologies is reportedly the result of government instruction. DigiTimes outlined a new strategy: "as CXMT scales up, it's also shifting rapidly to DDR5. The company only began mass-producing DDR4 in late 2024, yet it's already expected to issue an end-of-life (EOL) notice by the third quarter of 2025. The speed of this pivot and retooling has surprised many across the industry. Industry sources say the sudden shift is policy-driven, as Beijing pushes key chipmakers to accelerate alignment with national goals, especially around AI and cloud infrastructure." Murmurs of CXMT's forthcoming exit from DDR4 production have spread across local chip making businesses; causing a sudden doubling of Nanya-branded 8 Gb DDR4 chip prices in China. The manufacturer's early journey into DDR5 territories looked promising on paper—around January 2025—but the latest DigiTimes report disclosed inside track info regarding troubled quality and yield issues. In particular, initial samples have reportedly exhibited unstable performance when crossing a 60°C (140°F) threshold.

In the run-up to Computex 2025, Intel sent out mixed messages about the future of Arc Xe2 "Battlemage" desktop graphics cards. A combination of first-party teasers and "official leaks" (courtesy of AIBs) indicated an (eventual) introduction of professional B-series products. PC hardware enthusiasts were looking forward to a possible unveiling of higher-end gaming cards; the rumor mill has floated a "B770" option in recent times. Industry observers detected further encouraging pre-release signs; a "B750" identifier was discovered on Intel Japan's website—likely existing as placeholder material. Team Blue's social media account drummed up additional hype, prior to the commencement of last week's key trade event.

The TechPowerUp crew and other media outlets did not stumble upon any Intel Arc Xe2 B750 or B770 specimens at the Taipei Nangang Exhibition Center. According to a mid-visit Tweakers.net article, several unnamed figures (likely board partner company representatives) divulged inside track knowledge during Computex 2025. The online publication outlined a smattering of details: "sources close to Intel confirm the existence of the Arc B770 video card. According to them, the introduction is planned for the second half of this year. The card is expected to appear in the fourth quarter, although the planning can of course still change. Intel is working on an Arc B770 video card based on the 'Battlemage' architecture. Tweakers was able to confirm this with multiple sources during Computex. So far, Intel has only released lower-positioned B570 and B580 video cards with this architecture." Now defunct product roadmaps had the "Battlemage" series wrapped up by 2024, but delays and other factors have allegedly caused major timeline slippages. An industry expert claimed that a larger "BMG-G31" GPU development project was closed down at some point late last year, but fresher production activities have generated renewed beliefs that the "Battlemage" gaming line will expand beyond "cheaper" tiers.

Late last week, tech news headlines were generated by a curious Qualcomm/NUVIA job advertisement. The presence of Xbox-related activities—at the US firm's Redmond, Washington office—has set off watchdog alarm bells. Microsoft's HQ is also located in this Seattle Metropolitan Area business hub. The job description outlined a sales director position—including interesting tidbits: "support sell-in activities for the next generation of Surface and Xbox products built on Snapdragon solutions" and "help define the next generation Surface and Xbox portfolios." Older leaks have suggested Microsoft's weighing up of ARM64 processor architecture, with next-gen Xbox designs in mind. Since the publication of widespread reportage, Qualcomm has edited out any mention of Xbox from the offending job ad. Given the latest evidence, fresh speculation has emerged from online media outlets. In theory, the company's hardware engineers could be formulating a next-gen Arm-based handheld—not directly related to "Project Kennan."

Jez Corden, executive editor of Windows Central, has dismissed many next-gen "handheld" or "home console" projections. Insiders believe that in-progress first-party development centers around AMD (x86) solutions. Similarly, Sony is reportedly collaborating with Team Red. The speculated PlayStation 6 (and a handheld offshoot) has been linked to Zen 6 and UDNA/RDNA 5 IPs. In response to initial claims, Corden reached out to shadowy industry figures. As disclosed in his opinion piece: "sources confirmed to me this morning that the next Xbox systems are not based on Qualcomm chips. There might be some third-party "Designed for Xbox" Arm-based offerings, like the Logitech G Cloud. But, the main plan from Microsoft, at least for now, is for the next-gen Xbox systems to have as much compatibility with your current library as possible. The overheads required to emulate games built for Microsoft's AMD-based systems are beyond what the Snapdragon line up is currently capable of." Today, Digital Foundry pointed out that Microsoft's "Xbox Play Anywhere" marketing campaign has created a looser categorization of related hardware. Thus providing extra scope for adjacent and supplemental devices (in the near future).

Acer's dedicated Computex 2025 preview landing page mostly concentrates on brand-new AI PC products, but eagle-eyed observers have noticed the inclusion of an NDA-busting item. The manufacturer's web marketing team has inadvertently unveiled their forthcoming Nitro Radeon RX 9060 XT OC 16 GB model; days in advance of AMD's official unveiling (May 21). Over a week ago, momomo_us shared a screenshot of an unnamed retailer's listing of not-yet-official Acer Nitro 16 GB and 8 GB SKUs. The keen tech industry watcher followed up with today's discovery; complete with a promotional render.

As expected, the Taiwanese brand has prepared a new dual-fan design—borrowing elements from semi-recently revealed Radeon RX 9070 Series cards. Despite rumors of leveraging lesser hardware—probably a "Navi 44 XT" GPU—Acer's pre-launch hype material has outlined an ambitious resolution target: "enjoy stunning 8K visuals and use AI tools to craft your next masterpiece based on RDNA 4 architecture." Acer acts as a board partner for Team Red and Team Blue—surprisingly, the firm's pre-game teaser does not outline an upcoming Intel Xe2 "Battlemage" desktop product line. Instead, a fresh-ish Nitro Arc "Alchemist" A380 LP 6 GB model was placed next to the aforementioned Radeon RX 9060 XT card. So far—during day zero booth inspections—the TechPowerUp has not stumbled upon any physical examples of cheaper RDNA 4 options.

The Surface Laptop Studio 2 could be the last of its kind; according to Tom Warren's latest theories. Yesterday, The Verge's senior editor envisioned a streamlined future lineup of Microsoft's portable PC devices. According to inside track information, the tech giant is expected to announce the end-of-life (EOL) status for this relatively young branch of Surface products (debuted back in 2021). The Surface Laptop Studio 2 is advertised as being "a laptop like no other"—courtesy of a unique/versatile setup that features a "dynamic woven hinge." Three hybrid configurations are officially outlined as: "laptop mode for productivity, stage mode for streaming, and studio mode for creativity." Current generation models are powered by Intel's 13th Gen Core i7-13700H processor (aka the "Evo" platform), and can be configured with discrete NVIDIA mobile graphics solutions (GeForce RTX 4060, RTX 4050, or RTX 2000 Ada Generation). Under normal circumstances, a baseline build—reliant on an iGPU—starts at about $2400.

At the time of writing, Microsoft has not acknowledged The Verge's insider report. So far, resellers have shared top secret info—indicating an upcoming official announcement; possibly due by next month. Another group of unnamed sources claim that Surface Laptop Studio 2 manufacturing activities have already ended, as of early May (2025). The megacorporation has culled other Surface products in the past; sometimes coinciding with the departure of key executive team members and mass layoffs. A few days ago, mainstream news outlets covered Microsoft's latest batch of staff reductions—affecting roughly 6000 workers. Warren's article dashes all hopes of a potential third-gen design: "there doesn't appear to be a Surface Laptop Studio 3 on the horizon."

Yesterday, Lei Jun—the CEO of Xiaomi—finally introduced his firm's proprietary XRING 01 mobile chipset, via a couple of Weibo posts. In an initial afternoon short blog entry, the executive informed his followers with a happy unveiling: "I would like to share with you a piece of news: Xiaomi's self-developed and designed mobile phone SoC chip, named XRING 01, will be released in late May. Thank you for your support!" About a month ago, the company's oft-rumored return to in-house chip efforts was linked to a major corporate offshoot. The speculated "chip platform department" was likely established a while ago, given early May reports of the division's staff headcount exceeding 1000+. At the time, an "Xring" codename was mentioned by industry tipsters (in China).

In a follow-up "Weibo Text" bulletin, Xiaomi's head honcho recalled older project timelines and technological attempts: "even drinking ice for ten years can't cool your blood! Xiaomi's journey to making chips began in September 2014. Time flies, and more than ten years have passed in the blink of an eye...Figures 2 and 3 are photos of Xiaomi's first chip launch conference in February 2017." Jun's did not provide any hints about the XRING 01 chip's underpinnings. Late 2024 leaks alluded to a reportedly troubled prototype—insiders connected this design to fairly new Arm Cortex architecture, and a TSMC 4 nm "N4P" node process. The vast majority of Xiaomi's modern flagship smartphone devices utilize top-end Qualcomm Snapdragon chipsets. For example, the brand's latest Xiaomi Ultra 15 model is powered by the ubiquitous Snapdragon 8 Elite (Gen 4) platform.

According to a Financial Times (FT) news article, the US Government's Bureau of Industry and Security (BIS) is considering an implementation of additional "export blacklist" entries. Roughly two months ago, a significant update affected the export trade of around eighty Chinese business "entities." Despite a recent "cooling off" of elevated tariff-related activities, significant political tensions still exist between the two powerhouse nations. According to five of FT's unnamed insiders, ChangXin Memory Technologies (CXMT)—a rising star within China's growing memory manufacturing industry—is a potential candidate for "banishment." Semiconductor Manufacturing International Corp (SMIC), and Yangtze Memory Technologies Co. are (allegedly) already categorized as blacklisted organizations.

Apparently, the nation's most prominent chipmaker and memory module producer (respectively) have managed to sidestep certain restrictions, via offshoot avenues. FT believes that the US administration is actively investigating several of these subsidiaries. CXMT seems to be an independent body, with no military connections—specializing in commercial DDR5 and DDR4 products—but its rising profile has attracted international attention. Around March 2024, Bloomberg heard rumors about the US BIS department's "weighing up" of sanctions, with CXMT in mind. The relatively young DRAM manufacturer (established back in 2016) still trails behind South Korean and Western competitors, in terms of technological advancements—but its initial DDR5 efforts have (supposedly) impressed local evaluators and early adopters.